Semiconductor Bonding Market Research Report: Information Based on Process Type (Die-To-Die Bonding, Die-To-Wafer Bonding, and Wafer-To-Wafer Bonding) and Region (North America, Europe, Asia-Pacific, Middle East & Africa, and South America)— Forecast till 2027
Pune, India - January 19, 2022 /MarketersMedia/ —
Market Highlights
The global semiconductor bonding market is expected to reach USD ~865.7 million by 2020, registering a CAGR of ~3.11% during the forecast period. In this report, Market Research Future (MRFR) offers a better glimpse of the market by including the segmentation and dynamics in the coming years.
Segmentation:
The global semiconductor bonding market has been segmented based on process type, technology, type, application, and region.
Based on process type, the semiconductor bonding market has been segmented into die-to-die bonding, die-to-wafer bonding, wafer-to-wafer bonding. The die-to-wafer bonding segment is expected to grow at the highest rate. This segment enables processes to accelerate the deployment of 3D/heterogeneous integration and bring about new generations of devices with high bandwidth, high performance, and low power consumption. Wafer-to-wafer bonding is a process for the temporary or permanent joining of two or more wafers with or without an intermediate layer.
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Based on technology, the semiconductor bonding market has been segmented into die bonding and wafer bonding. The die bonding segment likely to hold a larger market share during the forecast period as it used for making electrical connections to chips. The wafer bonding segment is expected to register a higher CAGR during the forecast period. The wafer bonding is used to ensure a mechanically stable and hermetically sealed encapsulation.
Based on type, the semiconductor bonding market has been segmented into die bonder, wafer bonder, and flip chip bonder. The wafer bonder segment holds the largest market share during the forecast period as it protects the devices from possible contamination of subsequent processes such as dicing and die singulation. The flip-chip segment allows for a large number of interconnects with shorter distances than wire, which reduces inductance.
Based on application, the semiconductor bonding market has been segmented into RF devices, MEMS and sensors, CMOS image sensors, LED, and 3D NAND. The LED application segment is expected to grow at the highest rate due to the rising demand for led components in the home and infrastructure market. Increasing demand from consumer electronics manufacturers and adoption of patient monitoring solutions during the COVID-19 pandemic contributed to Mems and Sensors segment growth.
Based on region, the semiconductor bonding market has been segmented into North America, Asia-Pacific, Europe, the Middle East & Africa, and South America.
Regional Analysis:
The regional analysis for the global semiconductor bonding market has been done for North America, Europe, Asia-Pacific, the Middle East & Africa, and South America regions. The market in Asia-Pacific accounted for the largest market share in 2020, and it is expected to register sturdy growth during the forecast period. This growth can be attributed to the growing adoption of emerging technology.
Competitive Analysis
The key players of the global semiconductor bonding market are N.V. (Netherlands), ASM Pacific Technology Ltd (Singapore), Kulicke & Soffa (Singapore), Panasonic (Japan), Fuji Corporation (Japan), Yamaha Motor Robotics Corporation Co. (Japan), SUSS MicroTech SE (Germany), and Shiaura Mechatronics (Japan).
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Semiconductor Bonding Market Research Report: Information Based on Process Type (Die-To-Die Bonding, Die-To-Wafer Bonding, and Wafer-To-Wafer Bonding), Based on Technology [Die Bonding (Epoxy Die Bonding, Eutectic Die Bonding, Flip-chip Attachment, and Hybrid Bonding), Wafer Bonding (Direct Wafer Bonding, Anodic Wafer Bonding, TCB Wafer Bonding, and Hybrid Bonding)], Based on Type (Die Bonder, Wafer Bonder, and Flip-chip Bonder), Based on Application (RF Devices, Mems And Sensors, CMOS Image Sensors, LED, and 3D NAND), and Region (North America, Europe, Asia-Pacific, Middle East & Africa, and South America)— Forecast till 2027
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